The world's largest memory makers, Samsung, SK Hynix, and Micron, are working to add new fabrication capacity to meet demand, but nearly none of these facilities will be operational until at least 2027 or 2028. Despite this, Nikkei Asia reports that manufacturers are only expected to meet 60% of demand by the end of 2027. The new facilities will primarily produce high-bandwidth memory (HBM), which is used in AI data centers. The shortage of high-definition DRAM has led to increased prices for consumer electronics across the globe.