iPhone Fold rumored to feature 3D-printed hinge
Airfind news item
By Marko Zivkovic
Published on April 2, 2026.
A new leak suggests that the hinge of the iPhone Fold will use "chip-level polymer printing 3D technology" and the iPhone 18 upgrades will only be limited to color changes. The claims were made by leaker Fixed Focus Digital, suggesting that Apple is focusing on developing a foldable iPhone with chip-level high-molecular 3D printing technology. This technology is already used for specific components such as the iPhone Air's USB-C port made from titanium. The company is also reportedly expanding its use of this technology to make iPhone casings using the technology. The codename of the alleged foldable phone will start with the letter M, contradicting the previously rumored V68 device identifier.
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